Berlin, Germany

17th - 18th October 2023

TechBlick is hosting the premier conference and exhibition on re-shaping the future of electronics focusing on the topics of printed, flexible, additive, hybrid, wearable, textile, 3D, structural and in-mold electronics. This cutting-edge event will attract the global community from innovators and material suppliers to equipment makers, manufacturers and end users – who will all gather here to reshape the future of electronics.

GIS will be attending and exhibiting at this event – visit the team at stand G7.